ZANG Likun

Associate Prof. Dr.
office location:--,
Research Interests:(1) design of metal-ceramic composite materials and study of their interface;

(2) Study on properties of thermal conductive phase change thermal interface materials;

(3) Design and properties of new type of lead-free electronic slurry


Scientific research achievements


Enrollment plan


Representative papers

(1)Likun Zang, Zhangfu Yuan, Hongxin Zhao,Xiaorui Zhang:Wettability of molten Sn-Bi–Cu solder on Cu substrate,Materials Letters,2009,63:2067–2069. ISSN: 0167-577X
(2)Likun Zang, Zhangfu Yuan, Hongyan Xu, Bingsheng Xu, Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503K to 673 K Applied Surface Science 257 (2011) 4877–4884 ISSN: 0169-4332
(3)ZANG LiKun, YUAN ZhangFu, ZHAN YaPeng, WANG ChenYu,XU BingSheng, Spreading Kinetics of a Sn-30Bi-0.5Cu Alloy on a Cu Substrate, Chinese Science Bulletin. 57(6), (2012) 682-686. ISSN:1001-6538
(4)Likun Zang, Zhangfu Yuan, Zhanmin Cao, Hiroyuki Matsuura, Fumitaka Tsukihashi, Reactive Wetting Processes and Triple-line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures,Journal of Electronic Materials, 2012, 41, 8: 2051-2056. ISSN:0361-5235
(5)Likun Zang, Zhangfu Yuan, Hongliang Yan, Xinxue Li, Wettability and Interfacial Characteristic of Sn-Ag-Cu solder on Ni Substrates at elevated temperatures, Advanced Materials Research. Vols. 554-556 (2012) pp 703-708
(6)Likun Zang , Zhangfu Yuan, Yuanqing Zhu, Bingsheng Xu , Hiroyuki Matsuura , Fumitaka Tsukihashi,Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523K to 673K,Colloids and Surfaces A: Physicochemical and Engineering Aspects. 414 (2012) 57– 65 ISSN:0927-7757

Postgraduate training


  • School of Chemistry and Biological Engineering, USTB
  • 30 Xueyuan Road, Haidian District, Beijing,100083