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(1)Likun Zang, Zhangfu Yuan, Hongxin Zhao，Xiaorui Zhang：Wettability of molten Sn-Bi–Cu solder on Cu substrate，Materials Letters，2009，63：2067–2069. ISSN: 0167-577X
(2)Likun Zang， Zhangfu Yuan, Hongyan Xu, Bingsheng Xu， Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503K to 673 K Applied Surface Science 257 (2011) 4877–4884 ISSN: 0169-4332
(3)ZANG LiKun, YUAN ZhangFu, ZHAN YaPeng, WANG ChenYu，XU BingSheng, Spreading Kinetics of a Sn-30Bi-0.5Cu Alloy on a Cu Substrate, Chinese Science Bulletin. 57(6), (2012) 682-686. ISSN:1001-6538
(4)Likun Zang, Zhangfu Yuan, Zhanmin Cao, Hiroyuki Matsuura, Fumitaka Tsukihashi， Reactive Wetting Processes and Triple-line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures，Journal of Electronic Materials, 2012, 41, 8: 2051-2056. ISSN:0361-5235
(5)Likun Zang, Zhangfu Yuan, Hongliang Yan, Xinxue Li, Wettability and Interfacial Characteristic of Sn-Ag-Cu solder on Ni Substrates at elevated temperatures, Advanced Materials Research. Vols. 554-556 (2012) pp 703-708
(6)Likun Zang , Zhangfu Yuan, Yuanqing Zhu, Bingsheng Xu , Hiroyuki Matsuura , Fumitaka Tsukihashi，Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523K to 673K，Colloids and Surfaces A: Physicochemical and Engineering Aspects. 414 (2012) 57– 65 ISSN:0927-7757

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